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1

Usage of porous Al2O3layers for RH sensing

Veronika Timár-Horváth, László Juhász, András Vass-Várnai, Gergely Perlaky

Journal:

Microsystem Technologies

Year:

2008

Language:

english

File:

PDF, 446 KB

english, 2008

2

Package hermeticity testing with thermal transient measurements

András Vass-Várnai, Márta Rencz

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 405 KB

english, 2009

3

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs

Vass-Varnai, A., Parry, J., Toth, G., Ress, S., Farkas, G., Poppe, A., Rencz, M.

Year:

2012

Language:

english

File:

PDF, 313 KB

english, 2012

4

[IEEE 2015 IEEE Applied Power Electronics Conference and Exposition (APEC) - Charlotte, NC, USA (2015.3.15-2015.3.19)] 2015 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tackling reliability of power module

He, Weikun Jimmy, Vass-Varnai, Andras, Wilson, John

Year:

2015

Language:

english

File:

PDF, 642 KB

english, 2015

5

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mission profile driven component design for adjusting product lifetime on system level

Szel, Attila, Sarkany, Zoltan, Bein, Marton, Bornoff, Robin, Vass-Varnai, Andras, Rencz, Marta

Year:

2015

Language:

english

File:

PDF, 468 KB

english, 2015

6

[IEEE 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2017.3.13-2017.3.17)] 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Full-circuit 3D electro-thermal modeling of an IGBT Power Inverter

Bornoff, Robin, Vass-Varnai, Andras, Blackmore, Byron, Wang, Gang, Wong, Voon Hon

Year:

2017

Language:

english

File:

PDF, 1.37 MB

english, 2017

7

[IEEE 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA (2018.3.19-2018.3.23)] 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Automated structure function object mapping

Blackmore, Byron, Bornoff, Robin, Proulx, Joe, Vass-Varnai, Andras

Year:

2018

File:

PDF, 488 KB

2018

8

Characterization method for thermal interface materials imitating an in-situ environment

András Vass-Várnai, Zoltán Sárkány, Márta Rencz

Journal:

Microelectronics Journal

Year:

2012

Language:

english

File:

PDF, 1.23 MB

english, 2012

9

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Failure prediction of IGBT modules based on power cycling tests

Sarkany, Zoltan, Vass-Varnai, Andras, Hantos, Gusztav, Rencz, Marta

Year:

2013

Language:

english

File:

PDF, 1.39 MB

english, 2013

10

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Measurement based compact thermal model creation - accurate approach to neglect inaccurate TIM conductivity data

Vass-Varnai, Andras, Bornoff, Robin, Sarkany, Zoltan, Ress, Sandor, Rencz, Marta

Year:

2011

Language:

english

File:

PDF, 743 KB

english, 2011

11

[IEEE 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC) - Rome, Italy (2008.09.24-2008.09.26)] 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems - Possibilities of humidity sensing with thermal transient testing on porous structures

Vass-Varnai, Andras, Furjes, Peter, Rencz, Marta

Year:

2008

Language:

english

File:

PDF, 1.08 MB

english, 2008

12

[IEEE 2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm 2013) - San Jose, CA (2013.3.17-2013.3.21)] 29th IEEE Semiconductor Thermal Measurement and Management Symposium - Issues of finding a proper golden-reference sample for TIM tester calibration

Vass-Varnai, Andras, Laky, S., Sarkany, Z., Barna, C., Rencz, M.

Year:

2013

Language:

english

File:

PDF, 433 KB

english, 2013

13

[IEEE amp; Management Symposium (SEMI-THERM) - Santa Clara, CA (2010.02.21-2010.02.25)] 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Issues in junction-to-case thermal characterization of power packages with large surface area

Vass-Varnai, Andras, Shan Gao,, Sarkany, Zoltan, Jongman Kim,, Seogmoon Choi,, Farkas, Gabor, Poppe, Andras, Rencz, Marta

Year:

2010

Language:

english

File:

PDF, 384 KB

english, 2010

14

[IEEE 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (MEMS/MOEMS) - Nice, France (2008.04.9-2008.04.11)] 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Package hermeticity testing with thermal transient measurements

Vass-Varnai, Andras, Rencz, Marta

Year:

2008

Language:

english

File:

PDF, 2.62 MB

english, 2008

15

[IEEE 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2012.03.18-2012.03.22)] 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Application of thermal transient testing for solar cell characterization

Vass-Varnai, A., Plesz, B., Sarkany, Z., Malek, A., Rencz, M.

Year:

2012

Language:

english

File:

PDF, 1.99 MB

english, 2012

16

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - An approach for an industrial method for the in-situ characterization of thermal interface materials

Vass-Varnai, Andras, Sarkany, Zoltan, Barna, Csaba, Rencz, Marta

Year:

2010

Language:

english

File:

PDF, 1.39 MB

english, 2010

17

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Impact of nonlinearities in boundary conditions on device compact thermal models

Janicki, Marcin, Torzewicz, Tomasz, Vass-Varnai, Andras, Napieralski, Andrzej

Year:

2013

Language:

english

File:

PDF, 2.46 MB

english, 2013

18

Characterization of solar cells by thermal transient testing

Plesz, Balázs, Vass-Várnai, András

Journal:

Microelectronics Journal

Year:

2014

Language:

english

File:

PDF, 2.04 MB

english, 2014

19

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Investigation of die-attach degradation using power cycling tests

Sarkany, Zoltan, Vass-Varnai, Andras, Rencz, Marta

Year:

2013

Language:

english

File:

PDF, 662 KB

english, 2013

20

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Simulation based method to eliminate the effect of electrical transients from thermal transient measurements

Vass-Varnai, Andras, Sarkany, Zoltan, Szel, Attila, Rencz, Marta

Year:

2014

Language:

english

File:

PDF, 296 KB

english, 2014

21

[IEEE Management Symposium (SEMI-THERM) - San Jose, CA, USA (2011.03.20-2011.03.24)] 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - New level of accuracy in TIM measurements

Vass-Varnai, Andras, Szekely, Vladimir, Sarkany, Zoltan, Rencz, Marta

Year:

2011

Language:

english

File:

PDF, 404 KB

english, 2011

22

[IEEE 2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm 2013) - San Jose, CA (2013.3.17-2013.3.21)] 29th IEEE Semiconductor Thermal Measurement and Management Symposium - Transient thermal characterization of a fcBGA-H device

Ouyang, E., Ahn, B., Bornoff, R., Weikun He,, Islam, N., Gwang Kim,, KyungOe Kim,, Vass-Varnai, A.

Year:

2013

Language:

english

File:

PDF, 2.54 MB

english, 2013

23

[IEEE 2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm 2013) - San Jose, CA (2013.3.17-2013.3.21)] 29th IEEE Semiconductor Thermal Measurement and Management Symposium - A detailed IC package numerical model calibration methodology

Bornoff, R., Vass-Varnai, A.

Year:

2013

Language:

english

File:

PDF, 754 KB

english, 2013

24

[IEEE 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2014.3.9-2014.3.13)] 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies

Sarkany, Zoltan, Vass-Varnai, Andras, Laky, Sandor, Rencz, Marta

Year:

2014

Language:

english

File:

PDF, 440 KB

english, 2014

25

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Package Characterization: Simulations or Measurements?

Poppe, Andras, Vass-Varnai, Andras, Farkas, Gabor, Rencz, Marta

Year:

2008

Language:

english

File:

PDF, 5.06 MB

english, 2008

26

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Reliability testing of TIM materials with thermal transient measurements

Vass-Varnai, Andras, Sarkany, Zoltan, Rencz, Marta

Year:

2009

Language:

english

File:

PDF, 672 KB

english, 2009

27

[IEEE 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2015.3.15-2015.3.19)] 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Lifetime estimation of power electronics modules considering the target application

Szel, Attila, Sarkany, Zoltan, Bein, Marton, Bornoff, Robin, Vass-Varnai, Andras, Rencz, Marta

Year:

2015

Language:

english

File:

PDF, 382 KB

english, 2015

28

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Analysis of concurrent failure mechanisms in IGBT structures during active power cycling tests

Sarkany, Zoltan, Vass-Varnai, Andras, Rencz, Marta

Year:

2014

Language:

english

File:

PDF, 332 KB

english, 2014

29

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Comparison of different power cycling strategies for accelerated lifetime testing of power devices

Sarkany, Zoltan, Vass-Varnai, Andras, Rencz, Marta

Year:

2014

Language:

english

File:

PDF, 1.06 MB

english, 2014

30

[IEEE 2015 IEEE Aerospace Conference - Big Sky, MT (2015.3.7-2015.3.14)] 2015 IEEE Aerospace Conference - Effect of power cycling parameters on predicted IGBT lifetime

Sarkany, Zoltan, Vass-Varnai, Andras, Rencz, Marta

Year:

2015

Language:

english

File:

PDF, 357 KB

english, 2015

31

[IEEE 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Greenwich, London, United Kingdom (2014.9.24-2014.9.26)] 20th International Workshop on Thermal Investigations of ICs and Systems - Separation of failure modes in short cycle time power cycling experiments

Sarkany, Zoltan, Vass-Varnai, Andras, Rencz, Marta

Year:

2014

Language:

english

File:

PDF, 627 KB

english, 2014

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